United States
US 12,703,006 B2
Method for manufacturing ultrasonic transducer, ultrasonic transducer, and distance measuring equipment
US 12,703,006 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: Mitsubishi Electric Corporation. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Mitsubishi Electric Corporation
- Inventors
- Yoshiaki HIRATA; Yoshitaka KAJIYAMA
- Publication date
- 2026-08-11
- Filing date
- 2024-06-25
- Document type
- B2 Granted patent
- Also written as
- US 12,703,006 B2 · US12703006 · 12703006
Abstract
A method for manufacturing an ultrasonic transducer comprises the following steps: A first SOI substrate including a first silicon film, a second silicon film, and an intermediate silicon oxide film sandwiched between the first silicon film and the second silicon film is prepared. A piezoelectric element is formed on the first silicon film of the first SOI substrate. The second silicon film is etched to form a diaphragm. A silicon substrate is connected to the second silicon film.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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