United States
US 12,703,044 B2
Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package
US 12,703,044 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: Samsung Electronics Co., Ltd. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Samsung Electronics Co., Ltd.
- Inventors
- Sinyeop LEE; Taegyu KANG; Jaeseon HWANG
- Publication date
- 2026-08-11
- Filing date
- 2023-05-24
- Document type
- B2 Granted patent
- Also written as
- US 12,703,044 B2 · US12703044 · 12703044
Abstract
A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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