United States
US 12,703,057 B2
Method for detection of wafer slippage
US 12,703,057 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: Applied Materials, Inc. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Applied Materials, Inc.
- Inventors
- Wei Lu; Yu-Chi Yeh; Kun-Yo Lin; Wade Chung; Harry Q. Lee; Nick Huang; Jianshe Tang
- Publication date
- 2026-08-11
- Filing date
- 2023-03-17
- Document type
- B2 Granted patent
- Also written as
- US 12,703,057 B2 · US12703057 · 12703057
Abstract
Exemplary methods for detecting substrate slippage include sweeping a first sensor and a second sensor of an in-situ monitoring system across the substrate as the substrate undergoes polishing with a rotatable platen. A first sequence of signal values from the first sensor and a second sequence of signal values from the second sensor include a signal strength relative to the thickness of the layer.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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