United States
US 12,703,058 B2
Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method
US 12,703,058 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: EBARA CORPORATION. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- EBARA CORPORATION
- Inventors
- Toshifumi KIMBA; Kohei OHSHIMA; Kohei OTA
- Publication date
- 2026-08-11
- Filing date
- 2023-04-20
- Document type
- B2 Granted patent
- Also written as
- US 12,703,058 B2 · US12703058 · 12703058
Abstract
A surface property measuring system capable of accurately measuring a surface property of a polishing pad without damaging the polishing pad and without reducing throughput of the entire polishing process is disclosed. The surface property measuring system includes: an optical measuring device configured to direct light to a polishing surface of a polishing pad when the polishing pad is rotating, and measure a surface property of the polishing pad based on reflected light from the polishing surface; a cover member disposed between the optical measuring device and the polishing pad; and a trans…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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