United States
US 12,703,059 B2
Polishing pad, double-side polishing device, and double-side polishing method for wafer
US 12,703,059 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: SHIN-ETSU HANDOTAI CO., LTD. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- SHIN-ETSU HANDOTAI CO., LTD.
- Inventors
- Junichi UENO
- Publication date
- 2026-08-11
- Filing date
- 2023-05-04
- Document type
- B2 Granted patent
- Also written as
- US 12,703,059 B2 · US12703059 · 12703059
Abstract
The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90° peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90° peeling adhesive strength A to a 180° peeling adhesive strength B of 1.05 or more, the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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