United States
US 12,703,061 B2
Polishing apparatus
US 12,703,061 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: Kyushu Institute of Technology; EBARA CORPORATION. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- Kyushu Institute of Technology; EBARA CORPORATION
- Inventors
- Hisanori MATSUO; Keisuke SUZUKI
- Publication date
- 2026-08-11
- Filing date
- 2022-05-27
- Document type
- B2 Granted patent
- Also written as
- US 12,703,061 B2 · US12703061 · 12703061
Abstract
The present invention relates to a polishing apparatus and a polishing method for polishing a workpiece, such as a wafer on which a pattern is formed, on a polishing pad, and more particularly, relates to a polishing apparatus and a polishing method for detecting a geometric element of a pattern, such as a pitch.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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