United States
US 12,703,062 B2
Wafer grinding parameter optimization method and electronic device
US 12,703,062 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: GlobalWafers Co., Ltd. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- GlobalWafers Co., Ltd.
- Inventors
- Chih-Chun Cheng; Wen-Nan Cheng; Meng-Bi Lin; Chi-Feng Li; Tzu-Fan Chiang; Wei-Jen Chen; Chien Hung Chen; Hsiu Chi Liang; Ying-Ru Shih
- Publication date
- 2026-08-11
- Filing date
- 2023-09-12
- Document type
- B2 Granted patent
- Also written as
- US 12,703,062 B2 · US12703062 · 12703062
Abstract
A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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