United States
US 12,703,063 B2
Substrate processing apparatus
US 12,703,063 B2 is a granted patent from the United States Patent and Trademark Office (USPTO), dated 2026-08-11. Applicant: EBARA CORPORATION. Its PDF downloads from this page without an account, up to 5 a day.
- Applicant
- EBARA CORPORATION
- Inventors
- MATSUTARO MIYAMOTO
- Publication date
- 2026-08-11
- Filing date
- 2023-09-06
- Document type
- B2 Granted patent
- Also written as
- US 12,703,063 B2 · US12703063 · 12703063
Abstract
The substrate processing apparatus according to the disclosure is a substrate processing apparatus for processing a substrate. The substrate processing apparatus includes a swing module, which includes a base portion, an arm which is supported by the base portion and is rotatable about the base portion, and a cover which covers an upper surface of the arm. The cover has an elongated shape in plan view and has a protrusion formed on an outer peripheral portion of an upper surface of the cover to protrude upward.…
The opening of the abstract. The full text is in the PDF.
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Patent office website: United States Patent and Trademark Office (USPTO)
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